Gold painting

Gold Plating

Gold plating is a key feature of metal components used in certain semiconductor capital equipment, allowing for uniform heating and reflectivity throughout a semiconductor chamber. Our products have a direct effect on the silicon wafer and are critical to its overall yield and performance, plating aluminum, brass, and copper substrates for the epitaxy market.

Gold plating is a key process required in the production of epitaxial semiconductor equipment, allowing for uniform heating and maximum reflectivity. Our products are directly involved in producing the silicon wafer and are critical to its overall yield and performance. Our proprietary plating process has achieved unprecedented quality and performance standards within the semiconductor industry.

Recognized as a world leader in precision plating applications specific to the semiconductor industry, we bring more than 40 years of experience and are the market leader in epitaxial manufacturing specializing in complex metal fabrication of customer-designed products for gold reflectivity. Our team is expert in fabricating these multicomponent assemblies made from a variety of materials, including aluminum, brass, copper, stainless steel and ceramic.

The Gold Plating Process

There are several critical steps to ensure the highest quality and performance:

  1. Manufacturing: The substrate is manufactured and inspected dimensionally to ensure all specifications are met. Then the substrates are polished to a mirror finish to achieve the desired surface finish and reflectivity. It Is this process that guarantees the luster of the gold in the end.
  2. Surface Preparation: The substrate material is thoroughly cleaned and prepared to ensure a smooth and contaminant-free surface. This step is crucial for achieving a strong bond for the electroplating.
  3. Electroplating: The prepared substrate is then subjected to an electroplating process where a thin layer of nickel is deposited onto the surface. From there, the component is plated with a layer of gold. This process involves immersing the substrate in an electrolyte solution containing gold ions and applying an electric current to facilitate the deposition of gold onto the finished product.
  4. Quality Control: After the electroplating process, the gold-plated components undergo rigorous quality control checks to ensure uniformity, thickness, and adhesion of the gold layer. Advanced inspection techniques, such as X-ray fluorescence (XRF), and thickness as well as reflectivity are checked to verify the quality of the plating. This step ensures that the components meet the stringent performance standards required for semiconductor applications.

Our proprietary gold plating process not only enhances the performance and reliability of semiconductor equipment, but also contributes to the overall efficiency and yield of the manufacturing process. With our extensive experience and expertise, we continue to set new benchmarks in the industry for quality and innovation in gold plating.

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